Semiconductor packaging and testing is the step that verifies the function and performance of chips, circuits and other semiconductor products, screening out those with structural defects or substandard performance so that delivered products work properly.
In semiconductors, OSAT mainly protects, supports, interconnects, dissipates heat and assures reliability. Chip fabs need strict conditions (constant T/RH, cleanroom); chips only work properly in suitable environments, which ordinary surroundings rarely provide. Hence sealing and testing create a good working environment. Precision semiconductor cleanrooms therefore need dedicated cleanroom ovens.
