vacuum reflow
Lower the hole and increase the reliability of the weld.
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Reflow
CS-VR10N semiconductor vacuum reflow
Reflow soldering under vacuum.
Highlights
Multi-zone
Curves can match the device with welding.
Seal friendly
Service power and high reliability.
Connectable
Accept and accept with the back and forth processes.
Overview
Vacuum re-welding systems for high-reliability electronic seals and low-altitude welding requirements.
Key data
ProcessVacuum reflow soldering
ApplicationsPower devices / packaging
ControlMulti-zone temperature profiles
NotesVacuum and temperature capability per model documentation
Process / industry use
- PCB
- DCB substrates
- Semiconductor packaging
Need a process-fit design?
Send temperature, atmosphere, takt and workpiece size to engineering and sales.
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