Profiles of well-known IC packaging and testing companies worldwide
In Q1 2017, 9 of the top 10 packaging and testing companies published financial reports. By Q1 revenue the top ten were: ASE, Amkor, JCET, SPIL, Powertech, Huatian, Tongfu, KYEC, ChipMOS and UTAC. Supported by the National IC Industry Investment Fund since 2015, mainland Chinese packaging and testing companies have grown rapidly and become one of the three leading forces in the global industry. Below is a list of well-known packaging and testing companies worldwide, in no particular order:
1. ASE (acquired SPIL)
Headquarters: Taiwan | Mainland branch: Shanghai
Main business: semiconductor packaging and testing, front-end chip testing, wafer probing and back-end packaging, materials, final testing
ASE Group's total revenue in Q1 2017 was NT$66.551 billion, of which packaging and testing revenue was NT$36.174 billion, down 11.60% from NT$40.923 billion in the previous quarter.
2. (Amkor) J-devices
Headquarters: USA | Mainland branch: Shanghai
Main business: outsourced semiconductor packaging and test services
Amkor's total revenue in Q1 2017 was US$914 million, down 10% from the previous quarter; gross margin was 15.60%; it posted a loss of US$10 million, compared with a profit of US$100 million in the previous quarter.
Revenue from mid- to high-end products was US$383 million; packaging accounted for 81%; the top ten customers accounted for 67%.
3. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET, acquired STATS ChipPAC)
Headquarters: Jiangsu
Main products: diodes, Schottky rectifiers, transistors, Darlington transistors, digital transistors, voltage regulator circuits, thyristors, MOSFETs, switching transistors for energy-saving lamp chargers, and composite transistors.
Main customers: Spreadtrum, RDA, HiSilicon, Leadcore, Rockchip, etc.
JCET's Q1 2017 revenue reached RMB 5.025 billion, up 43.29% from RMB 3.506 billion a year earlier; operating profit was RMB -165 million, versus RMB -213 million a year earlier; net profit was RMB -105 million, versus RMB -168 million a year earlier. Revenue growth came mainly from JSCK's sales business and higher orders year on year.
4.
Headquarters: Suzhou
Main business: manufacturing, processing, trading and testing of all kinds of integrated circuit packages.
SPIL's Q1 2017 revenue was US$629 million, up 1.3% year on year and down 11.8% from the previous quarter; gross margin was 19.2%, operating profit US$56 million; net profit was US$32 million, down 38% year on year and 65% from the previous quarter.
5. Powertech Technology (acquired Greatek, a leading second-tier domestic packaging and testing company, in 2012)
Headquarters: Taiwan | Mainland branch: Suzhou
IC and microSD
Customer: Intel Hy-nix Elpida Toshiba SST
Powertech Technology 2017 Q1 revenue was NT$12.660 billion, up 19.2% from NT$10.618 billion a year earlier; gross margin 21.80%; operating profit NT$2.047 billion; net profit NT$1.482 billion, up 21.7%; net margin 11.70%.
6. Tianshui Huatian Technology Co., Ltd.
Headquarters: Gansu | Branches: Tianshui, Xi'an, Kunshan
Main business: 12 major series and more than 200 varieties of packaging and testing products, with an annual IC packaging capacity of 10 billion units. Its annual IC packaging capacity and sales revenue both rank second among listed companies in the industry in China.
Main customers: Silan Microelectronics, Actions Semiconductor (Zhuhai), Haier, Shanghai Belling, Wuxi China Resources Semico, etc.
Huatian Technology 2017 Q1 revenue reached RMB 1.486 billion, up 34.86% from RMB 1.102 billion a year earlier; operating profit RMB 138 million, up 63.50% from RMB 84 million; net profit RMB 126 million, up 52.33% from RMB 83 million.
7. Tongfu Microelectronics Co., Ltd.
Headquarters: Jiangsu
Main business: its successfully developed WLCSP, BGA, BUMP and high-reliability automotive electronics products and technologies are leading in China
Tongfu Microelectronics' Q1 2017 revenue reached RMB 1.446 billion, up 144.41% from RMB 592 million a year earlier; operating profit was RMB 33 million, up 76.96% from RMB 18 million; net profit was RMB 63 million, up 102.33% from RMB 31 million. The growth in revenue, operating profit and net profit came mainly from completing the acquisition of 85% stakes in AMD Suzhou and AMD Penang, which enlarged the scope of consolidation; in addition, excluding TF-AMD Suzhou and TF-AMD Penang, sales revenue grew 34% on a like-for-like basis, mainly as the projects funded by the company's capital raising began to deliver results.
8.
Headquarters: Taiwan | Mainland subsidiary: Jinglong Technology (Suzhou) Co., Ltd.
Main business: wafer probing, final IC testing, wafer grinding / dicing / die sorting.
KYEC's Q1 2017 revenue was NT$4.869 billion, up 11.7% year on year. Gross profit was NT$1.478 billion, a gross margin of 30%. Net profit for the period was NT$561 million.
9.
Headquarters: Taiwan | Mainland branch: Shanghai
Main business: back-end packaging and testing of high-frequency, high-density memory products and communication ICs
ChipMOS's Q1 2017 revenue reached NT$4.560 billion, down 3.4% from NT$4.724 billion a year earlier and down 7.3% from NT$4.925 billion in the previous quarter.
10. UTAC (Singapore)
Headquarters: Singapore | Mainland branch: UTAC (Shanghai) (closed), Dongguan
Consumes Electronic Memory and Wireless
UTAC's Q1 2017 revenue was US$165 million, down 10% from the previous quarter and up 5% year on year; gross margin was 17.4%; the loss for the quarter was US$28 million, versus US$41 million in the previous quarter and US$34 million a year earlier.
11. Chipbond Technology
Headquarters: Taiwan
Main business: tape carrier packaging (TCP), chip on film (COF) and chip on glass packaging.
12. Nepes
Headquarters: South Korea | Mainland plant: Jiangsu Nepes
Main business: a global leader in high-end packaging.
13. Unisem
Headquarters: Malaysia | Mainland plant: Chengdu Yuxin
Main business: a global provider of semiconductor assembly and test services, such as chip bumping, wafers, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer-level CSP, and RF, analog, digital and mixed-signal test services.
14. Formosa Advanced Technologies
Headquarters: Taiwan
DRAM and Customer: DRAM and and IC
15. Lingsen Precision Industries
Headquarters: Taiwan
Main business: dedicated packaging and test foundry
16. Shenzhen Guige Semiconductor Technology Co., Ltd.
Headquarters: Shenzhen
Main business: packaging and testing of LED driver ICs, power, communication, memory and image-sensor IC chips
17. China Wafer Level CSP Co., Ltd. (Suzhou)
Headquarters: Suzhou
Main business: image sensors, biometric identification, ambient light sensing, medical electronics, automotive sensors, etc.
18. Wuxi China Resources Ansheng Technology Co., Ltd.
Headquarters: Wuxi
Main business: a subsidiary of China Resources Microelectronics, focused on foundry services such as IC packaging / test solutions with the widest range of options for chip designers and wafer manufacturers in China and abroad
19. Carsem
Headquarters: Malaysia | Mainland branch: Shenzhen
Main business: semiconductor packaging and testing services
20. Wuxi Huajin Semiconductor Advanced Packaging Technology R&D Center Co., Ltd.
Main business: the company was jointly founded by five investors: the Institute of Microelectronics of the Chinese Academy of Sciences and the leading IC packaging and testing companies JCET, Tongfu Microelectronics, Huatian Technology and Shennan Circuits. Five more shareholders joined later: China Wafer Level CSP (Suzhou), Anjieli (Suzhou), Zhongke Wulian, Fastprint and the CDB Development Fund. It now has ten shareholders in total.
21. Suzhou Good-Ark Electronics
Headquarters: Suzhou
Main business: a world-renowned leading diode manufacturer
22. Suzhou ASEN Semiconductors Co., Ltd.
Headquarters: Suzhou
NXP and (ASE) 2007
23. Shenzhen Biwin Storage Technology Co., Ltd.
Headquarters: Shenzhen
SiP and LGA Smart Watch WIFI Bluetooth and OEM
24. Beijing Shougang Microelectronics Co., Ltd. (BSMC)
Headquarters: Beijing
Main business: design, manufacture, packaging and testing of large-scale integrated circuits.
Customer: NEC Toyota
25. Chizhou Huatai Semiconductor Co., Ltd. (NationT)
Main business: high-end back-end manufacturing focused on testing and packaging large-scale integrated circuits. Annual packaging and testing capacity: 1 billion ICs. Package types include DIP, SOP, TSSOP, SSOP, SOT, TO, QFP and QFN series. Main processes include incoming wafer inspection, wafer thinning, wafer dicing, die attach (die bonding), silver paste curing, wire bonding, molding, baking, plating (pure tin), laser marking, trim and form, visual inspection, final testing, and packing and shipping.
26. Chipmore Technology (Suzhou) Co., Ltd.
( ) (COF) (COG) LCD IC
27. Ningbo Xinjian Semiconductor Co., Ltd.
Main business: wafer level chip scale packaging (Wafer Level CSP), copper bump packaging (FC-Bumping) and related services, providing customers in China and abroad with complete solutions including wafer testing, package design and packaging and testing. Its products are widely used in smartphones, tablets, wearables and other electronics, and extend to energy saving and environmental protection, smart home, biomedicine, the Internet of Things, automotive electronics and defense.
28. Shenzhen Kangmu Technology Co., Ltd.
AFK SISTEMA MIKRON SOP7 SOP8 SOP14 SOP16 SOP28 TSSOP20 SSOP24 SOT23-3 / 5 / 6 DIP7 DIP8 and
29. Jiangsu Xinchao Technology Group Co., Ltd.
Main business: Jiangsu Xinchao Technology was founded in 2000; its predecessor was the Jiangyin Transistor Factory, founded in 1972. Its business covers IC packaging and testing, semiconductor chips, and the development, production and sale of smart meters.
30. Nantong Huada Microelectronics Group Co., Ltd.
Main business: Nantong Huada Microelectronics was founded in 2007; its predecessor was the Nantong Transistor Factory, founded in 1966. It mainly packages, tests and sells semiconductor devices
31. Freescale Semiconductor (China) Ltd.
Main business: Freescale Semiconductor (China) dates back to 1992 and has a packaging and testing plant in Tianjin, one of Freescale's two large chip testing and packaging plants worldwide.
32. Hitech Semiconductor (Wuxi) Co., Ltd.
Main business: Hitech Semiconductor (Wuxi) was jointly founded in 2009 by Taiji Industry and SK Hynix. It provides back-end services including IC chip probe testing, packaging, package testing, and module assembly and testing, with its latest process at the 20-nanometer class.
33. Intel Products (Chengdu) Co., Ltd.
Main business: Intel Products (Chengdu) was founded in 2003. It is one of Intel's largest chip packaging and testing centers worldwide and one of Intel's three wafer preparation plants; half of Intel's mobile device microprocessors worldwide come from Intel Chengdu.
34. Shanghai Kaihong Technology Co., Ltd.
Main business: Shanghai Kaihong Technology was founded in 1995 as a wholly owned subsidiary of DIC Electronics of the United States. It mainly works on SMD components and IC products; semiconductor function modules; multi-chip packaging; bare chip packaging; and high-power device packaging.
35. SanDisk Semiconductor (Shanghai) Co., Ltd. (SanDisk)
Main business: SanDisk Semiconductor (Shanghai) was founded in 2006 and is SanDisk's only full-function assembly and test plant. Its main business is designing, developing, testing, packaging and producing new electronic components and products.
36. China Chippacking Technology Co., Ltd. (Qipai)
Headquarters: Shenzhen
PDIP HDIP Qipai SOP ESOP SSOP TSSOP MSOP EMSOP SOT TO LQFP QFN DFN SIP
